Facilities

The Group has three well-equipped clean rooms, in which the majority of device fabrication takes place. Other labs house equipment for thin film, electrical, optical and mechanical characterisation, and also computing and CAD facilities, as described below:

• Annealing and Oxidation
• Metallization and Sputtering
• Metrology and Characterization
• Photolithography 
• Plasma Etching
• Wafer Bonding and Sawing
• Wet Benches
• Device Modelling and CAD Laboratory